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Title:
FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING/DIE BONDING FILM, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/157846
Kind Code:
A1
Abstract:
The present invention discloses a film-like adhesive. The film-like adhesive contains an epoxy resin, a phenolic resin, an elastomer and an inorganic filler. The ratio of the epoxy groups in the epoxy resin to the hydroxyl groups in the phenolic resin is 1.2 or more.

Inventors:
KANEKO TOMOYO (JP)
TANIGUCHI KOHEI (JP)
YAMAMOTO KAZUHIRO (JP)
TAZAWA TSUYOSHI (JP)
Application Number:
PCT/JP2023/005055
Publication Date:
August 24, 2023
Filing Date:
February 14, 2023
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/52; C09J7/35; C09J11/04; C09J115/00; C09J161/06; C09J163/00; H01L21/301
Domestic Patent References:
WO2020013250A12020-01-16
Foreign References:
JP2021129079A2021-09-02
JP2018016673A2018-02-01
JP2012246461A2012-12-13
JP2012060038A2012-03-22
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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