Title:
FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/225323
Kind Code:
A1
Abstract:
This film-like adhesive for semiconductors is provided with a first adhesive layer and a second adhesive layer provided upon the first adhesive layer, and the modulus of elasticity at 35°C of the film-like adhesive after curing is 3.0–5.0 GPa.
Inventors:
AKIYOSHI TOSHIYASU (JP)
SUGAWARA TAKEHIRO (JP)
SUGAWARA TAKEHIRO (JP)
Application Number:
PCT/JP2018/009996
Publication Date:
December 13, 2018
Filing Date:
March 14, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J7/10; C09J4/02; C09J7/35; C09J11/06; C09J201/00; H01L21/60
Domestic Patent References:
| WO2016117350A1 | 2016-07-28 |
Foreign References:
| JP2016174182A | 2016-09-29 | |||
| JP2013127014A | 2013-06-27 | |||
| JP2009182363A | 2009-08-13 | |||
| JP2001240816A | 2001-09-04 | |||
| JP2016076722A | 2016-05-12 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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