Title:
FILM-LIKE ADHESIVE AND SHEET FOR SEMICONDUCTOR PROCESSING
Document Type and Number:
WIPO Patent Application WO/2019/182001
Kind Code:
A1
Abstract:
A film-like adhesive having the following characteristics: (I) when an initial detected temperature of the melt viscosity of the film-like adhesive after being stored for 168 hours at 40°C is T168, and when the initial detected temperature of the melt viscosity of the film-like adhesive before being stored is T0, the difference ΔT168 between the T168 and the T0 is less than 10°C, and (II) when a gel fraction before the film-like adhesive is stored at 40°C is W0, W0 is no more than 15%.
Inventors:
FUSE KEISHI (JP)
Application Number:
PCT/JP2019/011659
Publication Date:
September 26, 2019
Filing Date:
March 20, 2019
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/00; C09J107/00; C09J109/00; C09J133/00; C09J163/02; C09J167/00; C09J171/10; C09J175/04; C09J179/04; C09J183/00; C09J201/00; H01L21/301; H01L21/52
Domestic Patent References:
| WO2016027888A1 | 2016-02-25 |
Foreign References:
| JP2001172590A | 2001-06-26 | |||
| JP2005089575A | 2005-04-07 | |||
| JP2016020476A | 2016-02-04 | |||
| JP2017045934A | 2017-03-02 | |||
| JP2017137453A | 2017-08-10 | |||
| JP2001220566A | 2001-08-14 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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