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Patent Searching and Data


Title:
FILM MANUFACTURING METHOD AND CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2022/034852
Kind Code:
A1
Abstract:
Provided is a method that enables a film, which includes particles of a layered material and has high particle orientability, to be manufactured. This film manufacturing method, for a film that includes particles of a layered material that includes one or layers, includes a slurry containing particles of the layered material in a liquid medium, and a feature in which gases are separately discharged from a nozzle, and caused to collide with one another outside of the nozzle, and the particles of the layered material are deposited on a substrate to form a film. The density of the particles of the layered material in the slurry may be 30 mg/mL or greater.

Inventors:
ABE MASANORI (JP)
Application Number:
PCT/JP2021/029149
Publication Date:
February 17, 2022
Filing Date:
August 05, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B05D1/02; B05D3/04; B05D7/24; H01B5/14; H01B13/00
Domestic Patent References:
WO2018212044A12018-11-22
WO2006101450A12006-09-28
Foreign References:
US20200240000A12020-07-30
JP2017078002A2017-04-27
JP2003272628A2003-09-26
CN107393622A2017-11-24
US20200009846A12020-01-09
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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