Title:
FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/153794
Kind Code:
A1
Abstract:
Provided are: a film comprising a substrate, a base layer, and an adhesive layer in the stated order, the base layer including a cured reaction product of a (meth)acrylic polymer and a curing agent, and the rate of elongation of the base layer, which is derived using the formula (rate of elongation (%))=(elongation (mm) during breakage)×100/(distance (mm) between grippers before stretching), being 90% or greater as measured at a temperature of 25°C and a speed of 100 mm/min through a stretching test; and a method for manufacturing a semiconductor package in which the aforementioned film is used.
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Inventors:
TAKENAKA SATOSHI (JP)
KOTERA SEIGO (JP)
HASEGAWA TETSUYA (JP)
KOTERA SEIGO (JP)
HASEGAWA TETSUYA (JP)
Application Number:
PCT/JP2021/047062
Publication Date:
July 21, 2022
Filing Date:
December 20, 2021
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B27/00; B32B7/022; B32B27/30; C09J7/20; C09J7/29; C09J7/38; C09J133/00; C09J133/14; H01L21/56
Domestic Patent References:
| WO2018055859A1 | 2018-03-29 |
Foreign References:
| JP2006013452A | 2006-01-12 | |||
| JP2011151355A | 2011-08-04 | |||
| JP2019507827A | 2019-03-22 | |||
| JP2005243706A | 2005-09-08 | |||
| JP2005085832A | 2005-03-31 | |||
| JP2010083137A | 2010-04-15 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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