Title:
FILM AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/048545
Kind Code:
A1
Abstract:
This film comprises a substrate, an antistatic layer that is provided on a surface of the substrate, and a release layer provided on the surface of the antistatic layer opposite the substrate. The elongation rate, measured by tensile testing at a speed of 100 mm/minute and a temperature of 25°C and calculated using the formula below, is more than 90% and less than 255%. Elongation rate (%) = (elongation at breaking (mm) x 100) / (distance between grips before stretching (mm))
Inventors:
ABE TETSUO (JP)
KOGUCHI RYOHEI (JP)
KOTERA SEIGO (JP)
KOGUCHI RYOHEI (JP)
KOTERA SEIGO (JP)
Application Number:
PCT/JP2023/031094
Publication Date:
March 07, 2024
Filing Date:
August 29, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
H01L21/56; B29C33/68; B29C45/14; B32B7/022; B32B27/00
Domestic Patent References:
| WO2016125796A1 | 2016-08-11 | |||
| WO2022153794A1 | 2022-07-21 |
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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