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Title:
FILM MOLD AND IMPRINTING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/073370
Kind Code:
A1
Abstract:
The film mold according to the present embodiment comprises: a first resin layer that is made from a resin composition and has a pattern region including an uneven pattern; and a first glass substrate layer that is made from a thin film glass and is layered on a surface, of the first resin layer, opposite to the surface on which the pattern region is formed.

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Inventors:
OKAWA YASUHIRO (JP)
YOSHIOKA HIDENORI (JP)
Application Number:
PCT/JP2016/080540
Publication Date:
May 04, 2017
Filing Date:
October 14, 2016
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01L21/027; B29C59/02
Domestic Patent References:
WO2013147105A12013-10-03
WO2012018045A12012-02-09
WO2011155582A12011-12-15
Foreign References:
JP2011240643A2011-12-01
JP2005281101A2005-10-13
JP2013237157A2013-11-28
Other References:
See also references of EP 3370250A4
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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