Title:
FILM MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/210206
Kind Code:
A1
Abstract:
This film molding device is provided with: a cooling unit 104 that cools a molding material ejected from a die 102; and a rectifying unit 105 that rectifies cooling wind blown out from the cooling unit 104. The rectifying unit 105 includes a suction unit that suctions the cooling wind.
Inventors:
HIOKI KAZUYA (JP)
Application Number:
PCT/JP2022/013699
Publication Date:
October 06, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B29C55/28; B29C48/10; B29C48/32; B29C48/88; B29L23/00
Foreign References:
| JPS5859069A | 1983-04-07 | |||
| JPH06872A | 1994-01-11 | |||
| JPH068320A | 1994-01-18 | |||
| JPH0760833A | 1995-03-07 | |||
| JPH0834053A | 1996-02-06 | |||
| JPH0839667A | 1996-02-13 | |||
| JPH08290457A | 1996-11-05 | |||
| JPH08290458A | 1996-11-05 | |||
| JP2017177348A | 2017-10-05 |
Attorney, Agent or Firm:
MORISHITA Sakaki (JP)
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