Title:
FILM-PEELING METHOD, PROCESS FOR PRODUCTION OF OPTICAL FILM, FILM-PEELING MECHANISM, AND APPARATUS FOR PRODUCTION OF OPTICAL FILM
Document Type and Number:
WIPO Patent Application WO/2010/038697
Kind Code:
A1
Abstract:
A method for peeling a light-release film continuously from a substrate-less, double-sided, pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer which is laminated with the light-release film on one side of the pressure-sensitive adhesive layer and with a heavy-release film on the other side thereof. The method includes: applying at least one roll for changing the direction of conveyance to a substrate-less, double-sided, pressure-sensitive adhesive sheet; peeling a light-release film from the substrate-less, double-sided, pressure-sensitive adhesive sheet along the contact line between the substrate-less, double-sided, pressure -sensitive adhesive sheet and the roll, while changing, along the roll, the direction of conveyance of the light-release film and/or the direction of conveyance of the substrate-less, double-sided, pressure-sensitive adhesive sheet from which the light-release film has been removed; and adjusting the angle (θ1) between the release side of the light-release film and the release side of the substrate-less, double-sided, pressure -sensitive adhesive sheet from which the light-release film has been removed to 28 degrees or above. In peeling a light-release film from a substrate-less double-sided pressure-sensitive adhesive sheet, the method enables stable release and suppresses the adhesion of an adhesive to the light-release film.
Inventors:
INAO YOUICHI (JP)
ETOH HIROYUKI (JP)
KANDA TOSHIMITSU (JP)
SUGIZAKI TOSHIO (JP)
HAYAKAWA MOTOYUKI (JP)
ETOH HIROYUKI (JP)
KANDA TOSHIMITSU (JP)
SUGIZAKI TOSHIO (JP)
HAYAKAWA MOTOYUKI (JP)
Application Number:
PCT/JP2009/066759
Publication Date:
April 08, 2010
Filing Date:
September 28, 2009
Export Citation:
Assignee:
LINTEC CORP (JP)
INAO YOUICHI (JP)
ETOH HIROYUKI (JP)
KANDA TOSHIMITSU (JP)
SUGIZAKI TOSHIO (JP)
HAYAKAWA MOTOYUKI (JP)
INAO YOUICHI (JP)
ETOH HIROYUKI (JP)
KANDA TOSHIMITSU (JP)
SUGIZAKI TOSHIO (JP)
HAYAKAWA MOTOYUKI (JP)
International Classes:
B65H41/00; B32B7/10; B32B37/00; B65H35/07; B65H37/04; C09J5/00; C09J7/00
Foreign References:
| JPH06340368A | 1994-12-13 | |||
| JPH06322327A | 1994-11-22 | |||
| JP2005059241A | 2005-03-10 | |||
| JPH11170775A | 1999-06-29 | |||
| JPH0853264A | 1996-02-27 | |||
| JPH04293983A | 1992-10-19 | |||
| JPH0741736A | 1995-02-10 | |||
| JP2004231723A | 2004-08-19 | |||
| JP2003020453A | 2003-01-24 |
Attorney, Agent or Firm:
OHTANI, Tamotsu (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
Download PDF:
Previous Patent: DISCHARGE UNIT, AND DISCHARGE APPARATUS
Next Patent: FIBER-REINFORCED RESIN COMPOSITION AND MOLDED OBJECT THEREOF
Next Patent: FIBER-REINFORCED RESIN COMPOSITION AND MOLDED OBJECT THEREOF