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Patent Searching and Data


Title:
FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2024/070963
Kind Code:
A1
Abstract:
The present invention provides a film production method involving applying, onto a base material, a photosensitive resin composition that includes (A) a resin, (C) a photopolymerization initiator, (D) a radical polymerization inhibitor, and (E) a solvent, then: involving a step for drying the photosensitive resin composition under a pressure of 5000 Pa or less; or involving a step for drying the photosensitive resin composition at a first temperature and a step for drying the photosensitive resin composition at a second temperature higher than the first temperature under a pressure within a range of ± 10% of the pressure in the step for drying the photosensitive resin composition at the first temperature; or involving only a step for drying the photosensitive resin composition at 90°C or higher for a period exceeding five minutes as a drying step. The radical polymerization inhibitor (D) is at least one compound selected from the group consisting of (D-1) a compound having a free radical within a molecule and (D-2) a compound having no free radical within a molecule and having a molecular weight of 270 or more. The invention also provides: a cured product production method using the photosensitive resin composition; a cured product obtained by curing the photosensitive resin composition; and a laminate comprising the cured product.

Inventors:
SAKITA KYOHEI (JP)
OGAWA MICHIHIRO (JP)
Application Number:
PCT/JP2023/034551
Publication Date:
April 04, 2024
Filing Date:
September 22, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F290/14; C08G73/10; G03F7/027; G03F7/09; G03F7/20; G03F7/26; H01L21/312
Domestic Patent References:
WO2021246457A12021-12-09
WO2020166510A12020-08-20
WO2017002859A12017-01-05
WO2013099785A12013-07-04
Foreign References:
JP2011099918A2011-05-19
JP2016075845A2016-05-12
JP2008040109A2008-02-21
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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