Title:
FILM-SHAPED ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/065783
Kind Code:
A1
Abstract:
Disclosed is a film-shaped adhesive for adhering together a semiconductor element and a support member upon which the semiconductor element is placed. The film-shaped adhesive includes a thermosetting resin, a curing agent, and an acrylic rubber. In the infrared absorption spectrum of the acrylic rubber, PCO and PCN satisfy the condition in formula (1), where PCO is the height of an absorption peak derived from carbonyl stretching vibrations and PCN is the height of a peak derived from nitrile stretching vibrations. The thickness of the film-shaped adhesive is 50 μm or less. (1): PCN/PCO<0.070
Inventors:
KUNITO YUI (JP)
YAMAMOTO KAZUHIRO (JP)
FUJIO SHUNSUKE (JP)
YAMAMOTO KAZUHIRO (JP)
FUJIO SHUNSUKE (JP)
Application Number:
PCT/JP2018/035768
Publication Date:
April 02, 2020
Filing Date:
September 26, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/52; C09J7/35; C09J11/08; C09J163/00; C09J201/00
Domestic Patent References:
| WO2010131655A1 | 2010-11-18 |
Foreign References:
| JP2013181049A | 2013-09-12 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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