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Patent Searching and Data


Title:
FILM WITH CONDUCTIVE LAYER, AND LAMINATED FILM FOR FILM ANTENNA
Document Type and Number:
WIPO Patent Application WO/2023/228535
Kind Code:
A1
Abstract:
A film (X) with a conductive layer according to the present invention comprises a film substrate (10) as a cycloolefin resin film substrate, a metal oxide layer (13), and a metal conductive layer (14) in this order in the thickness direction (H). The metal oxide layer (13) and the metal conductive layer (14) include the same metal element. The metal oxide layer (13) has a thickness of 15 nm or less.

Inventors:
USUI KEITA (JP)
TAKEYASU TOMOHIRO (JP)
Application Number:
PCT/JP2023/011396
Publication Date:
November 30, 2023
Filing Date:
March 23, 2023
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B9/00; B32B15/04; B32B15/20; H01B5/14; H01Q1/38
Domestic Patent References:
WO2016140073A12016-09-09
WO2022071273A12022-04-07
WO2018221183A12018-12-06
Foreign References:
JP2015133256A2015-07-23
JP2020128054A2020-08-27
JP2013139129A2013-07-18
JP2021186982A2021-12-13
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFFICE (JP)
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