Title:
FINGERPRINT RECOGNITION CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/000598
Kind Code:
A1
Abstract:
A fingerprint recognition chip packaging structure and a packaging method. The packaging structure comprises: a substrate (200), which is provided with a substrate surface; a sensor chip (201) coupled on the surface of the substrate (200), where the sensor chip (201) is provided with a first surface (210) and a second surface (220) opposite the first surface (210), the first surface (210) of the sensor chip (201) is provided with a sensing area (211), and the second surface (220) of the sensor chip (201) is arranged on the surface of the substrate (200); and, a lamination layer (203) arranged on the surface of the substrate (200) and on the surface of the sensor chip (201), where the lamination layer (203) covers the surface of the sensing area (211) of the sensor chip (201), a portion of the lamination layer (203) located at the surface of the sensing area (211) is of a preset thickness, and the material of the lamination layer (203) is a polymer. The packaging structure allows for reduced requirements on the sensitivity of the sensor chip, thus broadening applications.
Inventors:
WANG ZHIQI (CN)
YU QIONG (CN)
WANG WEI (CN)
YU QIONG (CN)
WANG WEI (CN)
Application Number:
PCT/CN2015/082717
Publication Date:
January 07, 2016
Filing Date:
June 30, 2015
Export Citation:
Assignee:
CHINA WAFER LEVEL CSP CO LTD (CN)
International Classes:
G06V30/144; H01L23/31; H01L21/56; H01L23/60
Foreign References:
| CN1694260A | 2005-11-09 | |||
| CN102244047A | 2011-11-16 | |||
| CN204029789U | 2014-12-17 | |||
| CN104051368A | 2014-09-17 | |||
| CN103038782A | 2013-04-10 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
北京集佳知识产权代理有限公司 (CN)
北京集佳知识产权代理有限公司 (CN)
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