Title:
FINGERPRINT RECOGNITION MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/233562
Kind Code:
A1
Abstract:
Provided are a fingerprint recognition module and an electronic device, for improving the performance and structural reliability of a fingerprint recognition module. The fingerprint recognition module comprises a flexible circuit board, a substrate, a fingerprint recognition chip and a filling adhesive layer, wherein the flexible circuit board is arranged in a stacked manner with the substrate, and comprises a first end and a second end in opposite positions, at least one end of the first end and the second end is beyond the substrate, and a wire outlet area is formed, close to the end beyond the substrate, in the flexible circuit board; a first surface, arranged facing the flexible circuit board, of the substrate comprises a first area and a second area, the first area is provided with a wire and a pad used for electrically connecting to the flexible circuit board, and the second area is in a position opposite the wire outlet area and is provided with an open groove; the fingerprint recognition chip is arranged on a second surface, facing away from the flexible circuit board, of the substrate; and the filling adhesive layer is filled between the flexible circuit board and the substrate and is used for wrapping the pad.
Inventors:
WANG DAOHU (CN)
LI TONGTONG (CN)
ZHOU CHEN (CN)
XU CAIWEI (CN)
WANG YONG (CN)
LI TONGTONG (CN)
ZHOU CHEN (CN)
XU CAIWEI (CN)
WANG YONG (CN)
Application Number:
PCT/CN2020/091019
Publication Date:
November 26, 2020
Filing Date:
May 19, 2020
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G06F1/16
Foreign References:
| CN110320972A | 2019-10-11 | |||
| CN104932763A | 2015-09-23 | |||
| CN109299637A | 2019-02-01 | |||
| CN204539680U | 2015-08-05 | |||
| US20140369573A1 | 2014-12-18 |
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