Title:
FINGERPRINT SENSOR ASSEMBLY, FINGERPRINT SENSOR MODULE USING SAME, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/103172
Kind Code:
A1
Abstract:
An embodiment of the present invention provides a fingerprint sensor module, the assemblability and durability of which can be improved and a method for manufacturing the same. The fingerprint sensor module comprises a fingerprint sensor assembly, a tray, a connection assembly, and a cover part. The fingerprint sensor assembly comprises: a base substrate; a sensor part disposed on the upper surface of the base substrate; an package part disposed on the upper surface of the base substrate so as to cover the sensor part; a coating layer disposed on the upper surface of the package part; and a first connector mounted on the lower surface of the base substrate. The tray has an upper portion and a lower portion which are open, and receives the fingerprint sensor assembly so that the upper surface of the coating layer is exposed through the upper portion of the tray. The connection assembly is electrically connected to the first connector, and is disposed to extend from the lower portion of the tray to the inside and the outside of the tray. Furthermore, the cover part is disposed under the tray, and pressurizes the connection assembly, so that the fingerprint sensor assembly is fixed to the tray.
Inventors:
KIM HUN RAE (KR)
KIM DONG SEL (KR)
PARK JI HO (KR)
KIM DONG SEL (KR)
PARK JI HO (KR)
Application Number:
PCT/KR2017/013303
Publication Date:
May 31, 2019
Filing Date:
November 21, 2017
Export Citation:
Assignee:
GAEMA TECH CO LTD (KR)
International Classes:
H01L25/18; H01L23/28; H01L23/485; H01L23/495
Foreign References:
| KR20150131829A | 2015-11-25 | |||
| JP2007012040A | 2007-01-18 | |||
| KR20140123919A | 2014-10-23 | |||
| KR20130111464A | 2013-10-10 | |||
| KR20170016265A | 2017-02-13 | |||
| KR20150059341A | 2015-06-01 |
Attorney, Agent or Firm:
HAN, Sang Soo (KR)
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