FINGERPRINT SENSOR AND ELECTRONIC APPARATUS

WIPO Patent Application WO/2023/173342

A1

Disclosed in the present application are a fingerprint sensor and an electronic apparatus, belonging to the technical field of sensing. The fingerprint sensor comprises a substrate, photosensitive devices, light-emitting modules and a protective cover plate. The protective cover plate is internally provided with a plurality of conductive structures electrically connected to the light-emitting modules, and an orthographic projection of each conductive structure on the substrate at least partially overlaps with an orthographic projection of the corresponding photosensitive device on the substrate, thus ensuring that fingerprint ridges in a finger of a user can be electrically connected to the light-emitting modules by means of the conductive structures, whilst the protective cover plate can protect the light-emitting modules, thereby enabling the fingerprint sensor to normally detect the fingerprint of the finger of the user. Therefore, the probability that the sides of the light-emitting modules away from the substrate are liable to be scratched can be effectively reduced, thereby achieving a good sensing effect of the fingerprint sensor.

KONG DEXI (CN)
LI CHENG (CN)
ZHOU LIN (CN)
CHEN ZIXIAO (CN)
HUANG GEN (CN)
CAI SHOUJIN (CN)
ZHANG JIE (CN)
CHENG JIN (CN)
WANG YINGZI (CN)
ZHANG CAIXIA (CN)
TAN QIAN (CN)

PCT/CN2022/081281

September 21, 2023

March 16, 2022

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BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE OPTOELECTRONICS TECH CO LTD (CN)

H01L27/146

WO2017074097A1

2017-05-04

CN109791961A	2019-05-21
CN101656299A	2010-02-24
CN108878467A	2018-11-23
CN111564506A	2020-08-21

BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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