Title:
FIRST SUBSTRATE, MICROFLUIDIC CHIP, AND SAMPLE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/257007
Kind Code:
A1
Abstract:
A first substrate (100) for a microfluidic chip (300), a microfluidic chip (300), and a sample processing method. The first substrate (100) for a microfluidic chip (300) comprises: a first sample inlet (110), which is configured to receive a first fluid; a first reaction zone (160), wherein a first upstream end (162) of the first reaction zone (160) is in communication with the first sample inlet (110) by means of a flow channel; a second sample inlet (130), which is configured to receive a second fluid; a second reaction zone (150), wherein an upstream end (152) of the second reaction zone (150) is in communication with the second sample inlet (130) by means of a flow channel, and a downstream end (154) of the second reaction zone (150) is in communication with a second upstream end (163) of the first reaction zone (160) by means of a flow channel; a fluid backflow prevention zone (140), which is between the second reaction zone (150) and the first reaction zone (160), wherein an upstream end (142) of the fluid backflow prevention zone (140) is in communication with the downstream end (154) of the second reaction zone (150) by means of a flow channel, and a downstream end (144) of the fluid backflow prevention zone (140) is in communication with the second upstream end (163) of the first reaction zone (160) by means of a flow channel; and a sample outlet (180), wherein the sample outlet (180) is in communication with a downstream end (164) of the first reaction zone (160) by means of a flow channel.
Inventors:
LIU HAONAN (CN)
DING DING (CN)
DING DING (CN)
Application Number:
PCT/CN2021/098865
Publication Date:
December 15, 2022
Filing Date:
June 08, 2021
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE TECHNOLOGY DEV CO LTD (CN)
BEIJING BOE TECHNOLOGY DEV CO LTD (CN)
International Classes:
B01L3/00; G01N33/53
Domestic Patent References:
| WO2020232072A1 | 2020-11-19 |
Foreign References:
| CN208399514U | 2019-01-18 | |||
| CN209624608U | 2019-11-12 | |||
| CN109158136A | 2019-01-08 | |||
| CN107213928A | 2017-09-29 | |||
| US20070042427A1 | 2007-02-22 |
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (CN)
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