Title:
FIXED-ABRASIVE-GRAIN WIRE SAW DEVICE, AND WAFER PRODUCTION METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/053148
Kind Code:
A1
Abstract:
The present invention is provided with: a first reel (31) around which a pre-usage wire is wound; and a second reel (32) around which a post-usage wire is wound and retrieved. When workpiece processing is performed on a first occasion, wire having a length obtained by adding, to a stroke amount, a usage amount required for the second reel from the first reel to perform the workpiece processing on the first occasion, is unwound to the second reel, and the wire is subsequently supplied from the second reel to a processing part of a workpiece to perform the workpiece processing on the first occasion. Furthermore, when workpiece processing is performed on a second occasion and occasions thereafter, for each of said occasions, wire having a length corresponding to 1.5 to 2.5 times the usage amount used in the previous workpiece processing is unwound to the second reel, and the wire is subsequently supplied from the second reel to the processing part to perform the workpiece processing.
Inventors:
TANAKA YOSHIAKI (JP)
Application Number:
PCT/JP2014/076280
Publication Date:
April 16, 2015
Filing Date:
October 01, 2014
Export Citation:
Assignee:
YASUNAGA KK (JP)
International Classes:
B24B27/06; B28D5/04; H01L21/304
Foreign References:
| JP2009184023A | 2009-08-20 | |||
| JPH1110512A | 1999-01-19 | |||
| JP2013129046A | 2013-07-04 | |||
| CN101015943A | 2007-08-15 |
Attorney, Agent or Firm:
MIYAKAWA Kohichi (JP)
Hirokazu Miyagawa (JP)
Hirokazu Miyagawa (JP)
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