Title:
FLAME-RETARDANT ADHESIVE RESIN COMPOSITION AND FLEXIBLE PRINTED BOARD MATERIAL USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/105563
Kind Code:
A1
Abstract:
Provided is a flame-retardant adhesive resin composition to be used for a flexible
wiring board. The composition contains, as essential components, (a) a specified
epoxy resin, (b) a specified phosphorus-containing phenoxy resin, (c) a curing
agent, and (d) a curing accelerator. The flame-retardant adhesive resin composition
has excellent adhesive characteristics, such as high peel adhesive force, high
solder heat resistance, low flowability and the like by substantially not containing
halogen element.
Inventors:
TAUCHI SHIGEAKI (JP)
YOKOYAMA NAOKI (JP)
SATOU TETSUNORI (JP)
AIDA KATSUYUKI (JP)
YOKOYAMA NAOKI (JP)
SATOU TETSUNORI (JP)
AIDA KATSUYUKI (JP)
Application Number:
PCT/JP2008/054005
Publication Date:
September 04, 2008
Filing Date:
February 28, 2008
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL CO (JP)
TOTO KASEI KK (JP)
TAUCHI SHIGEAKI (JP)
YOKOYAMA NAOKI (JP)
SATOU TETSUNORI (JP)
AIDA KATSUYUKI (JP)
TOTO KASEI KK (JP)
TAUCHI SHIGEAKI (JP)
YOKOYAMA NAOKI (JP)
SATOU TETSUNORI (JP)
AIDA KATSUYUKI (JP)
International Classes:
C08G59/30; B32B15/08; B32B27/00; B32B27/34; C08G65/40; C09J7/00; C09J7/02; C09J11/04; C09J11/06; C09J163/00; C09J171/10; H05K1/03
Foreign References:
| JP2002003711A | 2002-01-09 | |||
| JP2004331783A | 2004-11-25 | |||
| JP2002060720A | 2002-02-26 | |||
| JP2001354936A | 2001-12-25 | |||
| JP2001323242A | 2001-11-22 | |||
| JP2001310939A | 2001-11-06 | |||
| JP2007177054A | 2007-07-12 |
Attorney, Agent or Firm:
TANAKA, Hiroshi et al. (19-14 Toranomon,1-chome, Minato-k, Tokyo 01, JP)
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