Title:
FLAT CABLE
Document Type and Number:
WIPO Patent Application WO/2023/127114
Kind Code:
A1
Abstract:
[Problem] To provide a safe, insulating flat cable that has high conduction performance. [Solution] A flat cable 1 comprises a pair of parallel, strip-shaped conductive thin plates 2, an insulation layer 3 that covers the pair of conductive thin plates 2, and a sheath protection layer 4 that covers the conductive thin plates 2 as covered by the insulation layer 3. The conductive thin plates 2 have a plate thickness of no more than 0.6 mm and a cross-sectional width of at least 4 mm, the insulation layer 3 has a thickness of at least 0.25 mm, the sheath protection layer 4 has a thickness of at least 0.25 mm, the total thickness is no more than 2 mm, and the total cross-sectional width is at least 20 mm.
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JP6620917 | Wiring member |
WO/2014/210133 | DEVICE CONNECTION CABLE WITH FLAT PROFILE |
Inventors:
SHIBATA HITOSHI (JP)
Application Number:
PCT/JP2021/048841
Publication Date:
July 06, 2023
Filing Date:
December 28, 2021
Export Citation:
Assignee:
KOUMEICAN CO LTD (JP)
NIIJIMA YOSHIHIRO (JP)
NIIJIMA YOSHIHIRO (JP)
International Classes:
H01B7/08
Domestic Patent References:
WO2018034098A1 | 2018-02-22 |
Foreign References:
JPH02201820A | 1990-08-10 |
Attorney, Agent or Firm:
ITAYA Yasuo et al. (JP)
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