Title:
FLAT DRUM BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/101200
Kind Code:
A1
Abstract:
Provided is a flat drum bonding device, comprising a slide sleeve sleeved on a main shaft, several support tiles located around the slide sleeve, each support tile being respectively connected on the slide sleeve via a pivot mechanism, and a drive mechanism used to drive the pivot mechanism to drive the support tiles to pivot between two positions parallel to the axial direction. The present flat drum bonding device achieves automatic fitting of various components, thereby reducing manual operations and lowering production costs. In addition, since a mechanical structure is used, the various components are not easily damaged, and disturbance caused by periodic replacement is thus eliminated. The mechanical structure ensures bonding quality, thereby improving tyre quality.
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Inventors:
WANG YANSHU (CN)
QI SICHEN (CN)
WEN DESHENG (CN)
LIU MING (CN)
HU MENG (CN)
LI YANHAI (CN)
TAN LILI (CN)
WANG XIANGZHU (CN)
QI SICHEN (CN)
WEN DESHENG (CN)
LIU MING (CN)
HU MENG (CN)
LI YANHAI (CN)
TAN LILI (CN)
WANG XIANGZHU (CN)
Application Number:
PCT/CN2014/094792
Publication Date:
July 09, 2015
Filing Date:
December 24, 2014
Export Citation:
Assignee:
MESNAC CO LTD (CN)
International Classes:
B29D30/30
Foreign References:
| CN203665974U | 2014-06-25 | |||
| CN1980787A | 2007-06-13 | |||
| CN103085301A | 2013-05-08 |
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