Title:
FLEXIBLE BISMALEIMIDE, BENZOXAZINE, EPOXY-ANHYDRIDE ADDUCT HYBRID ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2013/015469
Kind Code:
A1
Abstract:
A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Preferably, a flexible epoxy anhydride adduct modified solid bismaleimide and solid benzoxazine resin composition that can survive high temperature and high moisture conditions and maintain good adhesion strength and minimize the stress resulting from a coefficient of thermal expansion mismatch between a silicon die and a substrate which is Ball Grid Array solder mask or a smart card polyethylene terephthalate or silver or copper metal lead frame.
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Inventors:
SHIN YUN KIL (KR)
Application Number:
PCT/KR2011/005545
Publication Date:
January 31, 2013
Filing Date:
July 28, 2011
Export Citation:
Assignee:
PROTAVIC KOREA CO LTD (KR)
SHIN YUN KIL (KR)
SHIN YUN KIL (KR)
International Classes:
C09J163/00; C09J179/00; C09J201/00
Foreign References:
| US20050137277A1 | 2005-06-23 | |||
| US5510425A | 1996-04-23 | |||
| US20100056725A1 | 2010-03-04 | |||
| US7488766B2 | 2009-02-10 | |||
| US20070088134A1 | 2007-04-19 | |||
| JP2007169454A | 2007-07-05 | |||
| US5412002A | 1995-05-02 | |||
| US5962586A | 1999-10-05 |
Other References:
See also references of EP 2736999A4
Attorney, Agent or Firm:
PATENT LAW FIRM GRAND KOREA (735-36Yeoksam-dong, Gangnam-gu, Seoul 135-080, KR)
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Claims: