Title:
FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/241123
Kind Code:
A1
Abstract:
Disclosed in the present application are a flexible circuit board and a manufacturing method therefor. The manufacturing method for the flexible circuit board comprises: preparing a film; providing an imprinting mold having a protruding pattern; pressing to the film the protruding pattern on the imprinting mold, and forming on the surface of the film a recessed pattern; and filling the recessed pattern with a conductive material, so as to form a conductive circuit.
Inventors:
YUE CHUNBO (CN)
LI JIANLIN (CN)
WANG XIAOHUI (CN)
LI JIANLIN (CN)
WANG XIAOHUI (CN)
Application Number:
PCT/CN2023/080447
Publication Date:
December 21, 2023
Filing Date:
March 09, 2023
Export Citation:
Assignee:
SHENZHEN TCL NEW TECH CO LTD (CN)
International Classes:
H05K1/03; H05K1/02; H05K3/00; H05K3/10
Foreign References:
| CN1859829A | 2006-11-08 | |||
| CN115066086A | 2022-09-16 | |||
| TW200743421A | 2007-11-16 | |||
| US20190088820A1 | 2019-03-21 |
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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