Title:
FLEXIBLE CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/021184
Kind Code:
A1
Abstract:
Provided in the present invention is a flexible circuit board. The flexible circuit board of the present invention comprises a substrate, conductive layers formed on the substrate and having gaps, a first cover film covering the substrate and the conductive layers, and at least one second cover film covering the side of the first cover film away from the substrate. A first bonding layer of the first cover film is located between a first protective film and the substrate, and the thickness of the first protective film is less than 1mil, so that the first bonding layer can effectively fill the gaps of the conductive layers arranged on the substrate, thus improving the sealing for the conductive layers by the first cover film and reducing the possibility that the conductive layers are oxidized due to contact with air; a second bonding layer of the second cover film is located between the first protective film and a second protective film and is used for bonding the second cover film and the first cover film, and the at least one second cover film can increase the thickness and hardness of the flexible circuit board without changing the thickness of the protective film of the first cover film, enabling the first bonding layer to effectively fill the gaps among the conductive layers.
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Inventors:
CHEN GUOHUI (CN)
Application Number:
PCT/CN2022/112369
Publication Date:
February 01, 2024
Filing Date:
August 15, 2022
Export Citation:
Assignee:
AAC MICROTECH CHANGZHOU CO LTD (CN)
International Classes:
H05K1/02; H05K1/05
Foreign References:
| CN111629527A | 2020-09-04 | |||
| CN107592738A | 2018-01-16 | |||
| CN113133185A | 2021-07-16 | |||
| CN108575056A | 2018-09-25 | |||
| CN216795367U | 2022-06-21 | |||
| CN106793584A | 2017-05-31 |
Attorney, Agent or Firm:
UNI-INTEL PATENT AND TRADEMARK LAW FIRM (CN)
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