Title:
FLEXIBLE COPPER CLAD LAMINATED FILM, ELECTRONIC DEVICE INCLUDING SAME, AND METHOD OF MANUFACTURING FLEXIBLE COPPER CLAD LAMINATED FILM
Document Type and Number:
WIPO Patent Application WO/2021/125495
Kind Code:
A1
Abstract:
Disclosed are a flexible copper clad laminated film, an electronic device including same, and a method of manufacturing the flexible copper clad laminated film. The flexible copper clad laminated film comprises: a non-conductive polymer substrate; a nickel-containing plating layer located on at least one surface of the substrate; and a copper plated layer positioned on the nickel-containing plated layer, wherein the copper plated layer may have an alteration rate of a full width at half maximum of 0.01° or less that has been calculated by Equation 1 below with respect to the peak of a (111) plane in an X-ray diffraction spectrum. An alteration rate of a full width at half maximum (111) = {(a full width at half maximum after 60 days) – (an initial full width at half maximum)}
Inventors:
LEE JEONG DEOK (KR)
LEE YONG HO (KR)
JEONG WOO DEUK (KR)
LEE YONG HO (KR)
JEONG WOO DEUK (KR)
Application Number:
PCT/KR2020/011386
Publication Date:
June 24, 2021
Filing Date:
August 26, 2020
Export Citation:
Assignee:
TORAY ADVANCED MAT KOREA INC (KR)
International Classes:
C23C18/16; B32B15/20; C23C18/34; C23C18/40; H05K1/09
Foreign References:
| KR20060046786A | 2006-05-17 | |||
| EP2522445A1 | 2012-11-14 | |||
| KR20190118546A | 2019-10-18 | |||
| KR101189131B1 | 2012-10-10 |
Other References:
CHANG-MIN LEE , JUN-HYUNG LIM , SOO-MIN WANG , EUI-CHEOL PARK , JONG-HYUN SHIM , JIN-HYUN PARK , JINHO JOO , SEUNG-BOO JUNG: "Characterization of flexible copper laminates fabricated by Cu electro-plating process", TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, vol. 19, no. 4, 1 August 2009 (2009-08-01), pages 965 - 969, XP026470803, ISSN: 1003-6326, DOI: 10.1016/S1003-6326(08)60387-8
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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