Title:
FLEXIBLE ELECTRONIC MATERIAL, BREATHABLE MOISTURE-PERMEABLE ELECTRONIC ELEMENT, FLEXIBLE CIRCUIT, AND METHOD
Document Type and Number:
WIPO Patent Application WO/2023/155833
Kind Code:
A1
Abstract:
The present invention relates to the technical field of flexible electronic materials and flexible circuits. Disclosed are a flexible electronic material, a breathable moisture-permeable electronic element, a flexible circuit, and a method. The flexible electronic material is composed of a conductive region and an insulating region, the conductive region is made of an ink-absorbing material, fiber, or yarn, and the insulating region is made of an ink-repellent material, fiber, or yarn. The ink-absorbing material, fiber, or yarn refers to a material, fiber or yarn capable of adsorbing a conductive ink, and is capable of diffusing the conductive ink by means of a capillary force; and the ink-repellent material, fiber, or yarn refers to a material, fiber or yarn that does not absorb the conducive ink, and which can inhibit the diffusion of the conductive ink, the conductive ink being oil-based or water-based. According to the present invention, the problem of needing to frequently replace a template, silk screen, or ink box in conventional printing technology is solved, the method can be combined with various textile technologies or 3D printing technologies, the technology is mature, and the costs are low. In addition, inherent properties such as the stretchability, bendability, breathability, and moisture-permeability of a textile structure are retained.
Inventors:
LI YI (CN)
YI YANGPEIQI (CN)
YI YANGPEIQI (CN)
Application Number:
PCT/CN2023/076475
Publication Date:
August 24, 2023
Filing Date:
February 16, 2023
Export Citation:
Assignee:
NINGBO HENGLI DIGITAL TECH LIMITED (CN)
International Classes:
H01B5/00
Foreign References:
| CN101240475A | 2008-08-13 | |||
| CN1960022A | 2007-05-09 | |||
| US20180332712A1 | 2018-11-15 | |||
| CN103820909A | 2014-05-28 | |||
| CN112679772A | 2021-04-20 |
Attorney, Agent or Firm:
SHENZHEN DISI-ELITE INTELLECTUAL PROPERTY AGENCY (CN)
Download PDF:
Previous Patent: POWER SUPPLY CIRCUIT
Next Patent: USE OF 2-AMINO-3-HYDROXY-3-METHYLBUTYRIC ACID IN PROMOTING PLANT GROWTH
Next Patent: USE OF 2-AMINO-3-HYDROXY-3-METHYLBUTYRIC ACID IN PROMOTING PLANT GROWTH