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Patent Searching and Data


Title:
FLEXIBLE POLYAMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2021/106541
Kind Code:
A1
Abstract:
This flexible polyamide film is obtained by molding a polyamide including a unit formed of an aliphatic dicarboxylate (A1) having 18 or more carbon atoms and/or a unit formed of an aliphatic diamine (B1) having 18 or more carbon atoms, and is characterized in that, in the polyamide, the total of the contained amount of the unit formed of (A1) and the contained amount of the unit formed of (B1) is 10-92 mass%, and that the melting point of the film is 240°C or higher.

Inventors:
TAKI TOSHIO (JP)
MARUO TAKESHI (JP)
NAKAI MAKOTO (JP)
YAGI YUSUKE (JP)
Application Number:
PCT/JP2020/041800
Publication Date:
June 03, 2021
Filing Date:
November 10, 2020
Export Citation:
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Assignee:
UNITIKA LTD (JP)
International Classes:
C08G69/26; C08J5/18
Domestic Patent References:
WO2018056459A12018-03-29
WO2020085360A12020-04-30
Foreign References:
JP2014506614A2014-03-17
JP2017530218A2017-10-12
JPS61225213A1986-10-07
JPS6323927A1988-02-01
JP2006509878A2006-03-23
JP2018203865A2018-12-27
JP2015129271A2015-07-16
JP6061814B22017-01-18
JP2000186141A2000-07-04
Other References:
See also references of EP 4067408A4
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (JP)
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