Title:
FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD FABRICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2013/150816
Kind Code:
A1
Abstract:
Provided is a double-sided flexible printed circuit board, with which it is possible to reduce fabricating steps, to reliably carry out a connection between circuit patterns which are disposed on both lateral faces of an insulating substrate, and to efficaciously utilize a blind via hole forming region. A flexible printed circuit board (100) in which circuit patterns (5, 6) are formed on both lateral faces of an insulating substrate (2) is configured to comprise: a blind via hole (7) which passes from the surface of one circuit pattern (5) to the bottom face of the other circuit pattern (6); and a terminal surface plating layer (12) which is formed in the surface of the one circuit pattern wherein the blind via hole is formed, and which connects the one circuit pattern with the other circuit pattern via the blind via hole.
Inventors:
HAMADA TAKESHI (JP)
Application Number:
PCT/JP2013/052732
Publication Date:
October 10, 2013
Filing Date:
February 06, 2013
Export Citation:
Assignee:
SUMITOMO ELEC PRINTED CIRCUITS (JP)
International Classes:
H05K1/11; H05K3/42
Foreign References:
| JP2002026515A | 2002-01-25 | |||
| JP2002368380A | 2002-12-20 | |||
| JPH1051146A | 1998-02-20 |
Attorney, Agent or Firm:
NISHIMA, Hideaki et al. (JP)
Hideaki Futajima (JP)
Hideaki Futajima (JP)
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