FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

Title:

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2023/276510

Kind Code:

A1

Abstract:

A flexible printed circuit board comprising a base film and a first wire. The base film has a first surface. The first wire is disposed on the first surface directly or indirectly. The first wire has a first layer and a second layer. The first layer is disposed on the first surface. The second layer covers the first layer. On the first surface, a first groove is formed next to the first layer in plan view. The second layer that is on a side surface of the first layer is on a bottom surface and a side surface of the first groove.

More Like This:

JP2006148173	DOUBLE SIDED WIRING BOARD AND MANUFACTURING METHOD THEREOF
JPS60229395	METHOD OF PRODUCING PRINTED CIRCUIT BOARD
WO/2019/013040	LAMINATE, PRINTED WIRING BOARD IN WHICH SAME IS USED, FLEXIBLE PRINTED WIRING BOARD, AND MOLDED ARTICLE

Inventors:

FUKAYA YOSUKE (JP)
NITTA KOJI (JP)
SATO DAISUKE (JP)

Application Number:

PCT/JP2022/021763

Publication Date:

January 05, 2023

Filing Date:

May 27, 2022

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)

International Classes:

H05K3/18; H05K3/24

Foreign References:

JP2018116973A	2018-07-26
JP2014075163A	2014-04-24