Title:
FLEXIBLE PRINTED WIRING BOARD, BONDED MEMBER, PRESSURE SENSOR, AND MASS FLOW RATE CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/066872
Kind Code:
A1
Abstract:
A flexible printed wiring board (1) in which a first conductive pattern (4) disposed on a first surface (3a) for mounting a bare chip is only disposed in a bare chip-mounting region (3c). Preferably, the first conductive pattern (4) is disposed so as to avoid a position opposite a testing electrode (2b) with which the bare chip is provided. In this way, it is possible, in a flexible printed wiring board used for mounting a bare chip, to reliably prevent the occurrence of an erroneous operation due to conduction with a portion of the bare chip other than bumps thereof, and to increase the reliability of various devices using the bare chip.
Inventors:
UMEYAMA TAKAHIRO (JP)
Application Number:
PCT/JP2019/036907
Publication Date:
April 02, 2020
Filing Date:
September 20, 2019
Export Citation:
Assignee:
HITACHI METALS LTD (JP)
International Classes:
H01L23/12; H01L21/60
Domestic Patent References:
| WO2016056555A1 | 2016-04-14 |
Foreign References:
| JPH11163055A | 1999-06-18 | |||
| JP2011029498A | 2011-02-10 | |||
| JP2005340292A | 2005-12-08 | |||
| JP2002170910A | 2002-06-14 |
Attorney, Agent or Firm:
PROSPEC PATENT FIRM (JP)
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