Title:
FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/035248
Kind Code:
A1
Abstract:
This flexible printed wiring board according to an aspect of the present invention is provided with a base film that has an insulation property, and a conductive pattern laminated on one surface side of the base film, the flexible printed wiring board having a terminal connection region on one end edge side of the conductive pattern, wherein the flexible printed wiring board being provided with a reinforced part which is laminated on the other surface of the base film on a portion that faces at least the terminal contact region, and the shape of the end edge of the reinforced part on the other end edge side of the conductive pattern is a periodic shape that is configured from curved lines.
Inventors:
OKA YOSHIO (JP)
UCHITA YOSHIFUMI (JP)
ADACHI YOSHIRO (JP)
UCHITA YOSHIFUMI (JP)
ADACHI YOSHIRO (JP)
Application Number:
PCT/JP2018/016915
Publication Date:
February 21, 2019
Filing Date:
April 26, 2018
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K1/02; H05K1/11; H05K1/14; H05K3/28
Foreign References:
| JPS6242482A | 1987-02-24 | |||
| JPS6336075U | 1988-03-08 |
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
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