Title:
FLEXIBLE SUBSTRATE CUTTIN METHOD
Document Type and Number:
WIPO Patent Application WO/2020/113711
Kind Code:
A1
Abstract:
Disclosed is a flexible substrate cutting method, comprising the following steps: providing a flexible substrate with a preset cutting area thereon (101); covering a shelter on the non-cutting area of the flexible substrate to expose the cutting area (102); performing dry etching on the flexible substrate to decompose the part of the flexible substrate in the cutting area (103). The method can protect the internal elements of the flexible substrate in the cutting process.
Inventors:
ZHAO KAIXIANG (CN)
Application Number:
PCT/CN2018/123429
Publication Date:
June 11, 2020
Filing Date:
December 25, 2018
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L21/78
Foreign References:
| US20060073705A1 | 2006-04-06 | |||
| US20060088983A1 | 2006-04-27 | |||
| JP2005044901A | 2005-02-17 |
Attorney, Agent or Firm:
ESSEN PATENT&TRADEMARK AGENCY (CN)
Download PDF: