Title:
FLEXIBLE SUBSTRATE FILM BULK ACOUSTIC RESONATOR AND FORMING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/062384
Kind Code:
A1
Abstract:
A flexible substrate film bulk acoustic resonator and a forming method therefor conducive to raising the Q value of the resonator and improving the performance of the resonator. The forming method for the flexible substrate film bulk acoustic resonator comprises: a sacrificial layer (1101) is provided; a resonating structure (214) is formed on the sacrificial layer (1101); an upper acoustic reflection structure (210) is formed on the resonating structure (214); the sacrificial layer (1101) is removed, thereby obtaining a stacked structure, and then the stacked structure is transferred onto a flexible substrate (219) by means of a flipping process, the stacked structure comprising the resonating structure (214) and the upper acoustic reflection structure (210); and an encapsulating layer (201) is formed on the upper acoustic reflection structure (210).
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Inventors:
LIU BOHUA (CN)
ZHANG MENGLUN (CN)
PANG WEI (CN)
YANG QINGRUI (CN)
ZHANG MENGLUN (CN)
PANG WEI (CN)
YANG QINGRUI (CN)
Application Number:
PCT/CN2018/112083
Publication Date:
April 02, 2020
Filing Date:
October 26, 2018
Export Citation:
Assignee:
UNIV TIANJIN (CN)
International Classes:
H03H9/02; H03H3/007; H03H3/02
Foreign References:
| CN107508569A | 2017-12-22 | |||
| CN102291095A | 2011-12-21 | |||
| CN103607178A | 2014-02-26 | |||
| CN106209003A | 2016-12-07 | |||
| JP5302796B2 | 2013-10-02 |
Attorney, Agent or Firm:
CHINA SMART INTELLECTUAL PROPERTY LTD. (CN)
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