Title:
FLIP-CHIP BONDED IMAGER DIE
Document Type and Number:
WIPO Patent Application WO/2013/028616
Kind Code:
A3
Abstract:
An image sensor includes an imager die, a circuit board, and an optical layer. The circuit board is flip-chip bonded to the imager die. The optical layer is adhered to the circuit board and includes a first portion configured to refract light differently than a second portion. Both the first portion and the second portion are integrally formed with the optical layer.
Inventors:
PATTERSON TIMOTHY PATRICK (US)
MORAN TIM (US)
FORREST CRAIG (US)
MORAN TIM (US)
FORREST CRAIG (US)
Application Number:
PCT/US2012/051573
Publication Date:
June 27, 2013
Filing Date:
August 20, 2012
Export Citation:
Assignee:
IMI USA INC (US)
PATTERSON TIMOTHY PATRICK (US)
MORAN TIM (US)
FORREST CRAIG (US)
PATTERSON TIMOTHY PATRICK (US)
MORAN TIM (US)
FORREST CRAIG (US)
International Classes:
H01L27/146
Foreign References:
| EP1494277A2 | 2005-01-05 | |||
| US20050253211A1 | 2005-11-17 | |||
| US20020105002A1 | 2002-08-08 | |||
| US6396116B1 | 2002-05-28 | |||
| US20080246133A1 | 2008-10-09 |
Attorney, Agent or Firm:
FORBIS, Glenn, E. et al. (Fishman & Grauer PLLC39533 Woodward Avenue,Suite 14, Bloomfield Hills MI, US)
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