Title:
FLOOR STRUCTURE ADHESIVE AND FLOOR STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/047838
Kind Code:
A1
Abstract:
The present invention provides a floor structure adhesive for adhering and integrating a floor surface material (20) onto a subfloor material (30) laid onto a floor base (1), the floor structure adhesive being characterized by: containing calcium carbonate, a silanol condensation catalyst, and a polyoxyalkylene polymer having a trimethoxysilyl group; and not containing an aminosilane coupling agent. This floor structure adhesive makes it possible to prevent the occurrence of floor sounds and gaps, and easily remove the floor surface material from the subfloor material when the floor surface material is to be repaired.
Inventors:
MURAYAMA YUKIHIKO (JP)
Application Number:
PCT/JP2012/075246
Publication Date:
April 04, 2013
Filing Date:
September 28, 2012
Export Citation:
Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
E04F15/16; C09J11/04; C09J171/02
Foreign References:
| JP2000154637A | 2000-06-06 | |||
| JP2010529221A | 2010-08-26 | |||
| JPH1088818A | 1998-04-07 |
Attorney, Agent or Firm:
YAMAMOTO TAKUYA (JP)
Takuya Yamamoto (JP)
Takuya Yamamoto (JP)
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Claims: