Title:
FLOW-PATH-PLATE MANUFACTURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/162525
Kind Code:
A1
Abstract:
A flow-path-plate manufacturing apparatus (1) includes a perforating part (20) that perforates a flow-path forming plate (11), and a wave-shape forming part (30) that forms the perforated flow-path forming plate (11) into a wave shape. The perforating part (20) includes a pair of rollers (20a, 20b). The roller (20b) has cutting blades (21). The wave-shape forming part (30) includes a pair of first gears. The flow-path-plate manufacturing apparatus (1) further includes a first synchronous rotation part (50) that rotates the rotary shaft of the roller (20b) and the rotary shaft of a first gear in synchronization with each other.
Inventors:
MORIKAWA SHINYA (JP)
HOSOKAWA YOSHIHIRO (JP)
SHIMIZU AKINORI (JP)
SOTOKAWA HAJIME (JP)
KAWASAKI TAKAHIRO (JP)
HOSOKAWA YOSHIHIRO (JP)
SHIMIZU AKINORI (JP)
SOTOKAWA HAJIME (JP)
KAWASAKI TAKAHIRO (JP)
Application Number:
PCT/JP2020/004476
Publication Date:
August 13, 2020
Filing Date:
February 06, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B21D43/28; B21D53/02; F28D9/00; F28F3/06; F28F3/08
Domestic Patent References:
| WO2019117025A1 | 2019-06-20 |
Foreign References:
| JPS613996A | 1986-01-09 | |||
| JPH04344835A | 1992-12-01 | |||
| US4888972A | 1989-12-26 | |||
| JP2002066675A | 2002-03-05 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
Download PDF: