Title:
FLOW RATE SENSOR
Document Type and Number:
WIPO Patent Application WO/2016/039019
Kind Code:
A1
Abstract:
This flow rate sensor is provided with: a semiconductor chip which has a thermal flow rate sensing part on a main surface; a supporting member which supports the semiconductor chip; an intermediate member which is interposed between the supporting member and the semiconductor chip; and a sealing resin which covers the main surface of the semiconductor chip so that the flow rate sensing part is exposed therefrom. The intermediate member is formed from a filler-containing synthetic resin wherein a filler is contained in a synthetic resin, said filler having a higher elastic modulus and a lower linear expansion coefficient than the synthetic resin.
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Inventors:
KONO TSUTOMU (JP)
WATANABE TSUBASA (JP)
NAKATSUCHI HIROKI (JP)
TOKUYASU NOBORU (JP)
TASHIRO SHINOBU (JP)
SAKAMOTO TSUTOMU (JP)
WATANABE TSUBASA (JP)
NAKATSUCHI HIROKI (JP)
TOKUYASU NOBORU (JP)
TASHIRO SHINOBU (JP)
SAKAMOTO TSUTOMU (JP)
Application Number:
PCT/JP2015/070705
Publication Date:
March 17, 2016
Filing Date:
July 21, 2015
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
G01F1/684
Foreign References:
| JP2014134519A | 2014-07-24 | |||
| JP2008146750A | 2008-06-26 |
Attorney, Agent or Firm:
NAGAI, Fuyuki (JP)
Fuyuki Nagai (JP)
Fuyuki Nagai (JP)
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