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Patent Searching and Data


Title:
FLOWMETER
Document Type and Number:
WIPO Patent Application WO/2013/008273
Kind Code:
A1
Abstract:
Provided is a flowmeter having improved corrosion resistance. This flowmeter has a configuration of having: a silicon substrate having a diaphragm having a heater formed thereon; an aluminum pad formed on the silicon substrate; an organic protection film laminated on the silicon substrate; and a molding resin that covers the silicon substrate. The diaphragm has an exposed portion that is exposed from the organic protection film, the silicon substrate has an adhesive film laminated thereon, said adhesive film having high adhesiveness to the molding resin, and the silicon substrate has a bonding surface where the molding resin and the adhesive film are bonded to each other, said bonding surface being disposed between the exposed portion and the aluminum pad.

Inventors:
MATSUMOTO MASAHIRO (JP)
NAKANO HIROSHI (JP)
HANZAWA KEIJI (JP)
ASANO SATOSHI (JP)
Application Number:
PCT/JP2011/003993
Publication Date:
January 17, 2013
Filing Date:
July 13, 2011
Export Citation:
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Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
MATSUMOTO MASAHIRO (JP)
NAKANO HIROSHI (JP)
HANZAWA KEIJI (JP)
ASANO SATOSHI (JP)
International Classes:
G01F1/692
Foreign References:
JP2008157742A2008-07-10
JP2004294207A2004-10-21
JP2009071076A2009-04-02
JP2001050787A2001-02-23
Attorney, Agent or Firm:
INOUE, Manabu et al. (JP)
Manabu Inoue (JP)
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Claims: