Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FLUID CONTROL DEVICE AND HEAT TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2004/070801
Kind Code:
A1
Abstract:
A fluid control device, comprising a flow controller (13g) in a gas line (13), a pressure control system area (14) provided on the upstream side of the flow controller (13g) in the gas line (13), and an extension part (15) extending from the upstream side end of the gas line (13) in a direction orthogonal to the gas line (13), wherein supply sources of different types of processing gases A, B, and C are connected to the extension part (15).

Inventors:
OKABE TSUNEYUKI
OKURA SHIGEYUKI
Application Number:
PCT/JP2003/001338
Publication Date:
August 19, 2004
Filing Date:
February 07, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B01J4/00; C23C16/455; F16K27/00; F17D1/02; F17D1/04; G05D7/06; H01L21/02; H01L21/205; (IPC1-7): H01L21/205; G05D7/06; F16K27/00; F17D1/02; B01J4/00; C23C16/455; H01L21/02
Foreign References:
JP2003091322A2003-03-28
JP2003074800A2003-03-12
US20010013363A12001-08-16
JPH112400A1999-01-06
JPH07135207A1995-05-23
Attorney, Agent or Firm:
Yoshitake, Kenji (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo, JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: TAILORING NITROGEN PROFILE IN SILICON OXYNITRIDE USING RAPID THERMAL ANNEALING WITH AMMONIA UNDER UL...

Next Patent: TREATING SYSTEM AND OPERATING METHOD FOR TREATING SYSTEM