Title:
FLUORESCENT LIGHT SOURCE DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/152297
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a fluorescent light source device wherein high luminous efficiency and sufficiently high fluorescent intensity can be obtained in a fluorescent body.
A fluorescent light source device of the present invention is configured by being provided with a fluorescent plate that emits fluorescence when receiving excitation light, and a heat dissipating substrate that dissipates heat generated in the fluorescent plate, said fluorescent plate and heat dissipating substrate being bonded to each other with a solder layer therebetween. The solder layer has a void fraction equal to or lower than 75 %, and a void longest diameter equal to or less than 0.4 mm. Furthermore, the solder layer preferably has a void fraction equal to or less than 50 %, and a void longest diameter equal to or less than 0.2 mm.
Inventors:
KITAMURA SEIJI (JP)
INOUE MASAKI (JP)
INOUE MASAKI (JP)
Application Number:
PCT/JP2016/053921
Publication Date:
September 29, 2016
Filing Date:
February 10, 2016
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
F21V17/00; F21S2/00; F21V9/08; F21V9/16; F21V29/502; B23K35/26; C22C9/00; C22C13/00; F21Y115/30
Domestic Patent References:
| WO2014065051A1 | 2014-05-01 |
Foreign References:
| JP2015050124A | 2015-03-16 | |||
| JP2013084960A | 2013-05-09 | |||
| JP2014060164A | 2014-04-03 |
Other References:
KATSIS D.C. ET AL.: "Void-Induced Thermal Impedance in Power Semiconductor Modules: Some Transient Temperature Effects", IEEE TRANSACTONS ON INDUSTRY APPLICATIONS, vol. 39, no. 5, 2003, pages 1239 - 1246, XP011101764
Attorney, Agent or Firm:
OHI, Masahiko (JP)
Masahiko Oi (JP)
Masahiko Oi (JP)
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