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Patent Searching and Data


Title:
FLUX COMPOSITION CONTAINING MALEIC ACID-MODIFIED ROSIN ESTER OR MALEIC ACID-MODIFIED ROSIN AMIDE, FLUX CONTAINING SAID COMPOSITION, AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2020/241687
Kind Code:
A1
Abstract:
The purpose of this invention is to provide a soldering flux that suppresses residue cracking of flux residue and has excellent solder wettability. This invention provides a flux composition containing one or more selected from the group consisting of a maleic acid-modified rosin ester, a maleic acid-modified rosin amide, a hydrogenation product of the maleic acid-modified rosin ester, and a hydrogenation product of the maleic acid-modified rosin amide.

Inventors:
KAWASAKI HIROYOSHI (JP)
SHIRATORI MASATO (JP)
HASHIMOTO YUTAKA (JP)
MIYAGI NANAKO (JP)
Application Number:
PCT/JP2020/020923
Publication Date:
December 03, 2020
Filing Date:
May 27, 2020
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C13/00; B23K35/26; B23K35/363; C22C13/02
Foreign References:
JP2015042419A2015-03-05
JP2016120507A2016-07-07
JP2019042805A2019-03-22
JP2005059028A2005-03-10
JP2014054663A2014-03-27
JP2017186324A2017-10-12
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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