Title:
FLUX COMPOSITION FOR LEAD-FREE SOLDER, LEAD-FREE SOLDER COMPOSITION, AND RESIN FLUX CORED SOLDER
Document Type and Number:
WIPO Patent Application WO/2010/087316
Kind Code:
A1
Abstract:
Disclosed is a flux composition for a lead-free solder, which contains 8-65% by weight of dehydroabietic acid and 8-67% by weight of dihydroabietic acid relative to the total amount of the composition. The flux composition is capable of providing a solder composition which has a practically sufficiently high insulation resistance of the flux residue even in the case when the mount of use of an activator is reduced, while exhibiting good wettability, namely good solderability. The flux composition for a lead-free solder is also capable of providing a solder composition which does not inhibit the curing of various sealing resins and the like when sealing is carried out using one of the various sealing resins and the like, after soldering.
Inventors:
IWAMURA EIJI (JP)
KUBO NATSUKI (JP)
KUBO NATSUKI (JP)
Application Number:
PCT/JP2010/050930
Publication Date:
August 05, 2010
Filing Date:
January 26, 2010
Export Citation:
Assignee:
ARAKAWA CHEM IND (JP)
IWAMURA EIJI (JP)
KUBO NATSUKI (JP)
IWAMURA EIJI (JP)
KUBO NATSUKI (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00; C22C13/02
Foreign References:
| JP2008030105A | 2008-02-14 | |||
| JP2008106047A | 2008-05-08 | |||
| JPH0494891A | 1992-03-26 |
Attorney, Agent or Firm:
IWATANI, Ryo (JP)
Tatsu Iwatani (JP)
Tatsu Iwatani (JP)
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