Title:
FLUX FOR LEAD-FREE SOLDER, AND LEAD-FREE SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2016/199747
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a flux for a lead-free solder, which ensures solder metal wettability while a flux residue generated in a reflow process exhibits excellent insulation resistance and the storage stability of a solder paste is improved. The present invention relates to a flux for a lead-free solder, which contains (A) a rosin-based resin, (B) an activator, (C) a thixotropic agent and (D) a solvent, wherein (B) the activator contains (b1) a dibasic acid activator, (b2) a bromine-based activator and (b3) an amine-based activator represented by general formula (1)
R1-NH-R2
(In formula (1), R1 and R2 each independently denote an alkyl group having 6-10 carbon atoms.)
Inventors:
KUBO NATSUKI (JP)
ODA TAKESHI (JP)
ISHIGA FUMIO (JP)
ODA TAKESHI (JP)
ISHIGA FUMIO (JP)
Application Number:
PCT/JP2016/066848
Publication Date:
December 15, 2016
Filing Date:
June 07, 2016
Export Citation:
Assignee:
ARAKAWA CHEM IND (JP)
International Classes:
B23K35/363; B23K35/26; C22C12/00; C22C13/00; C22C13/02
Domestic Patent References:
| WO2012081688A1 | 2012-06-21 |
Foreign References:
| JP2003338682A | 2003-11-28 | |||
| JP2014195830A | 2014-10-16 |
Other References:
See also references of EP 3308901A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
Patent business corporation 3 Edakuni [Hajime] patent firm (JP)
Patent business corporation 3 Edakuni [Hajime] patent firm (JP)
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