Title:
FLUX FOR RESIN-CORED SOLDER, RESIN-CORED SOLDER, AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/123988
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide flux by which discharge of sediment is promoted, resin-cored solder in which the flux is used, and a soldering method. This flux for resin-cored solder contains 60-99.9 mass% (inclusive) of a rosin ester relative to the mass of the entire flux, and contains 0.1-15 mass% (inclusive) of covalent-bond halides relative to the mass of the entire flux. The flux for the resin-cored solder is used in linear resin-cored solder that is supplied to through-holes formed along the central axis of a soldering iron.
Inventors:
KURASAWA YOKO (JP)
ONITSUKA MOTOHIRO (JP)
TOKUTOMI HISASHI (JP)
ENDO KEI (JP)
HAMAMOTO KAZUYUKI (JP)
ONITSUKA MOTOHIRO (JP)
TOKUTOMI HISASHI (JP)
ENDO KEI (JP)
HAMAMOTO KAZUYUKI (JP)
Application Number:
PCT/JP2021/041302
Publication Date:
June 16, 2022
Filing Date:
November 10, 2021
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
DENSO CORP (JP)
DENSO CORP (JP)
International Classes:
B23K3/02; B23K35/14; B23K35/363
Domestic Patent References:
| WO2019142795A1 | 2019-07-25 |
Foreign References:
| JP2016120507A | 2016-07-07 | |||
| JP2020001077A | 2020-01-09 | |||
| JP2009195938A | 2009-09-03 | |||
| JP2021102218A | 2021-07-15 | |||
| JPH0542388A | 1993-02-23 | |||
| JPH0542389A | 1993-02-23 | |||
| JP2009195938A | 2009-09-03 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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