Title:
FLUX, RESIN FLUX CORED SOLDER USING FLUX, FLUX COATED SOLDER USING FLUX, AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/199645
Kind Code:
A1
Abstract:
The flux according to the present invention contains a rosin methyl ester, is solid or solid-like at 25°C, and is used in the inside of a resin flux cored solder or on the exterior of a flux coated solder.
Inventors:
KURASAWA YOKO (JP)
ISEKI HIROAKI (JP)
NAKAJIMA KENTA (JP)
ISEKI HIROAKI (JP)
NAKAJIMA KENTA (JP)
Application Number:
PCT/JP2021/003465
Publication Date:
October 07, 2021
Filing Date:
February 01, 2021
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/14; B23K35/363
Foreign References:
JP6638839B1 | 2020-01-29 | |||
JPH07185882A | 1995-07-25 | |||
JP2018167297A | 2018-11-01 | |||
DE102018112982A1 | 2019-12-05 | |||
JP2018167297A | 2018-11-01 | |||
JP2016120507A | 2016-07-07 | |||
JP2020059856A | 2020-04-16 |
Other References:
See also references of EP 4000793A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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