Title:
FOAM MOLDING COMPOSITION, FOAMED MOLDED BODY, ELECTRIC WIRE, METHOD FOR MANUFACTURING FOAMED MOLDED BODY, AND METHOD FOR MANUFACTURING ELECTRIC WIRE
Document Type and Number:
WIPO Patent Application WO/2022/030293
Kind Code:
A1
Abstract:
The purpose of the present disclosure is to provide a foam molding composition from which a foamed molded body and a foamed electric wire having excellent heat resistance, a small average bubble diameter, a high foaming rate, and favorable outer diameter stability can be manufactured. This foam molding composition is characterized by containing: a resin (A) having a thermal decomposition temperature of at least 330ºC; and at least one compound (B) selected from the group consisting of phosphate, a salt thereof, and a phosphate complex compound.
Inventors:
KOUNO HIDEKI (JP)
ISHII KENJI (JP)
TOKUDA MASATO (JP)
KITAHARA TAKAHIRO (JP)
ISHII KENJI (JP)
TOKUDA MASATO (JP)
KITAHARA TAKAHIRO (JP)
Application Number:
PCT/JP2021/027647
Publication Date:
February 10, 2022
Filing Date:
July 27, 2021
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
C08K5/521; C08J9/04; C08L71/08; C08L81/06; C08L101/12; H01B7/02; H01B13/14
Domestic Patent References:
WO2011118717A1 | 2011-09-29 | |||
WO2011118717A1 | 2011-09-29 |
Foreign References:
CN110591331A | 2019-12-20 | |||
US20190144627A1 | 2019-05-16 | |||
JP2013147566A | 2013-08-01 | |||
JP2008174752A | 2008-07-31 | |||
JP2016160416A | 2016-09-05 | |||
US20190169391A1 | 2019-06-06 | |||
JP2013147566A | 2013-08-01 | |||
JP2017157463A | 2017-09-07 | |||
JPH11130892A | 1999-05-18 | |||
US4764538A | 1988-08-16 |
Attorney, Agent or Firm:
TASS MEISTER PATENT FIRM (JP)
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