FOULING-RESISTANT SILICONE COMPOSITION

WIPO Patent Application WO/2001/081474

A1

A silicone polymer composition which comprises a silicone polymer and a hydrophilizing agent comprising an organometallic compound having a hydrolyzable eliminable group, an oligomer thereof, and/or a co-oligomer of two or more such organometallic compounds. The composition is excellent in ease of cleaning, ease of draining, antifogging properties, dew condensation prevention, antistatic properties, biocompatibility, etc. Also provided is a molded article.

JP2018080309	REPLICA MOLD-FORMING RESIN COMPOSITION, REPLICA MOLD, AND PATTERNING METHOD USING THE REPLICA MOLD
JP5557624	The film using a constituent and the constituent, an electric charge transportation layer, an organic electroluminescence element, and a formation method of an electric charge transportation layer
JP3950493	ELECTROCONDUCTIVE SILICONE RUBBER COMPOSITION, PRODUCTION OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS THEREFOR

CHIDA AKIRA (JP)
HONDA KAYOKO (JP)
YONEI YASUSHI (JP)
IMOTO KATSUHIKO (JP)
WADA SUSUMU (JP)
MOHRI HARUHIKO (JP)

PCT/JP2001/003292

November 01, 2001

April 17, 2001

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DAIKIN IND LTD (JP)
CHIDA AKIRA (JP)
HONDA KAYOKO (JP)
YONEI YASUSHI (JP)
IMOTO KATSUHIKO (JP)
WADA SUSUMU (JP)
MOHRI HARUHIKO (JP)

C08L83/04; C09D175/04; C09D183/04; (IPC1-7): C08L83/04; C08L71/02; C08L75/04; C08L83/02; C09D171/02; C09D175/04; C09D183/02; C09D183/04

WO1996026254A1	1996-08-29
WO1997011130A1	1997-03-27
WO1994006870A1	1994-03-31
WO1999025781A1	1999-05-27

JPS5912964A	1984-01-23
JPS5212218B1	1977-04-05
US5556914A	1996-09-17
US3377309A	1968-04-09
JPH10279804A	1998-10-20
JP2000063661A	2000-02-29
JPH04335086A	1992-11-24
JPS6397674A	1988-04-28
JPH10245504A	1998-09-14

Asahina, Sohta (2-22 Tanimachi 2-chom, Chuo-ku Osaka-shi Osaka, JP)

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