Title:
FPC MOUNTING MODULE, ELECTRONIC DEVICE, AND MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/029963
Kind Code:
A1
Abstract:
Provided in the present application are an FPC mounting module, an electronic device, and a mounting method. The FPC mounting module comprises a mounting portion and an FPC, the mounting portion being provided with a mounting hole, the FPC penetrating through the mounting hole, and a gap being formed between the FPC and an inner wall surface of the mounting hole. A first surface of the FPC is adhered to a first wall surface of the mounting hole by means of a first gluing portion. The gap is filled with a fluid adhesive to form a second gluing portion, the FPC being sealed and fixed in the mounting hole by means of the second gluing portion. The present application can prevent water entering an electronic device from the gap between the mounting hole and the FPC and damaging the electronic device. Compared with a conventional FPC mounting solution, since the fluid adhesive has certain degree of fluidity, narrow and irregular gaps can be better filled and sealed. Therefore, the present application can match mounting holes of different shapes, enabling an FPC to be used in more installation scenarios.
Inventors:
TANG DIANYING (CN)
LIU JIE (CN)
DING JIAFENG (CN)
ZHANG MIN (CN)
ZHANG HAO (CN)
LIU JIE (CN)
DING JIAFENG (CN)
ZHANG MIN (CN)
ZHANG HAO (CN)
Application Number:
PCT/CN2022/112469
Publication Date:
March 09, 2023
Filing Date:
August 15, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/14; H05K5/06
Foreign References:
| JP2012074526A | 2012-04-12 | |||
| CN213783867U | 2021-07-23 | |||
| CN111123685A | 2020-05-08 | |||
| CN1461133A | 2003-12-10 | |||
| CN202111026212A | 2021-09-02 |
Attorney, Agent or Firm:
YINKE PATENT & TRADEMARK AGENT (SHANGHAI) LTD. (CN)
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