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Patent Searching and Data


Title:
FROZEN NOODLE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/176651
Kind Code:
A1
Abstract:
The frozen noodle according to the present invention includes, as a frozen noodle string that is a frozen product of a cooked product of a raw noodle string, a specific frozen noodle string having a maximum diametrical length of 1.2 mm or more in a cross section taken in a direction orthogonal to the length direction of the frozen noodle string. A specific noodle string produced by thawing the specific frozen noodle string has a breaking strain ratio of 70 to 85% and a breaking load of 0.7 to 4.0 N when the specific noodle string is subjected to a rupture test using a rheometer equipped with a pressing jig under the conditions where the product temperature of the specific noodle string is 40°C and the pressing speed of the pressing jig is 0.5 mm/sec. The method for producing the frozen noodle according to the present invention is characterized by satisfying at least one of the requirements <1> and <2> mentioned below. <1> The noodle dough preparation step is performed under a pressure-reduced environment having a pressure reduction degree of -0.03 MPa or less. <2> The number of procedures for rolling the noodle dough through rolls in the rolling step is two or less.

Inventors:
EBIHARA SHU (JP)
NAKANISHI YUMIKO (JP)
WATANABE TAKENORI (JP)
OZAWA KEISUKE (JP)
Application Number:
PCT/JP2023/008949
Publication Date:
September 21, 2023
Filing Date:
March 09, 2023
Export Citation:
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Assignee:
NISSHIN SEIFUN WELNA INC (JP)
International Classes:
A23L7/109
Domestic Patent References:
WO2020040271A12020-02-27
Foreign References:
JP2011067163A2011-04-07
JPS58116643A1983-07-11
Other References:
XIE, LIYANG ET AL.: "Utilization of egg white solids to improve the texture and cooking quality of cooked and frozen pasta", LWT-FOOD SCIENCE AND TECHNOLOGY, vol. 122, no. 109031, 2020, pages 1 - 7, XP086051886, DOI: 10.1016/j.lwt.2020.109031
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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