Title:
FULL-ARRAY DIE ATTACHMENT DEVICE AND METHOD UTILIZED IN PRODUCING SURFACE-MOUNT QUARTZ CRYSTAL OSCILLATOR
Document Type and Number:
WIPO Patent Application WO/2018/006755
Kind Code:
A1
Abstract:
The invention relates to the field of electronic devices, and specifically, to a full-array die attachment device and method utilized in producing a surface-mount quartz crystal oscillator. The full-array die attachment device comprises a fixing device, a suction device located in the fixing device, and a transfer device detachably connected to the fixing device. A full array of dies to be attached on a full array of substrate bases (1) are arranged on the transfer device. The full array of dies comprise a plurality of dies. The suction device is in contact with the full array of dies at the transfer device. The full-array die attachment method comprises: transferring a plurality of dies together to form a full array of dies, to enable each of the full array of dies to correspond to a single substrate base configured directly therebelow. A pick-up tool (10) having a coating film suctions the dies together, and then places, on a full array of substrate bases (1) after applying an adhesive dispensing process thereon, all of the dies, reducing the time for die placement, providing a fast die attachment process, increasing the production efficiency by ten to hundred times, and expanding a production volume.
Inventors:
HUANG YI (CN)
LI BIN (CN)
LI BIN (CN)
Application Number:
PCT/CN2017/091032
Publication Date:
January 11, 2018
Filing Date:
June 30, 2017
Export Citation:
Assignee:
MDH TECH CO LTD (CN)
International Classes:
H03H3/02; H03H9/19
Foreign References:
| CN106067775A | 2016-11-02 | |||
| CN205754235U | 2016-11-30 | |||
| CN1738012A | 2006-02-22 | |||
| CN105305995A | 2016-02-03 | |||
| CN101594120A | 2009-12-02 | |||
| CN101867005A | 2010-10-20 | |||
| CN101515553A | 2009-08-26 |
Attorney, Agent or Firm:
YANTAI SHANGHE INTELLECTUAL PROPERTY AGENCY (GENERAL PARNERSHIP) (CN)
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